Panem, C.; Gad, R.S.; Kaushik, B.
(Microelectronics Journal. 116; 2021; ArticleID_105231.)
In symmetric 3-D chip stacking, TSVs plays an important role and provides denser and fine pitches. The number of vertical links in 3-D mesh NoC topology is equal to 2 (N - (sup(3) square root N sup(2))), where N is the ...